High-conductivity Copper Busbar

Grade

China GB T1
American ASTM C10200
European EN CW008A
Japanese JIS C1020

Chemical Composition

(Weight%)

Copper Cu ≥99.95
Iron Fe ≤0.005
Lead Pb ≤0.005
Tin Sn ≤0.002
Oxygen O ≤0.001
Phosphorus P ≤0.001
Zinc Zn ≤0.005

Product Characteristics

T1 has characteristics such as high conductivity, high thermal conductivity, good mechanical properties, and corrosion resistance.

Application Fields

● Rail Transit ● Heat Dissipation Components ● New Energy ● Electrical Discharge Machining ● High and Low Voltage Power Distribution ● Transformers

Physical Properties

Density 8.9 g/cm³
Conductivity @20℃ ≥100% %IACS
Electrical Conductivity @20℃C ≥58 MS/m
Thermal Conductivity @20℃C 386.4 W/(m·K)
Melting Point 1083
Elastic Modulus 100-110 GPa
Poisson's Ratio 0.33 GPa
Coefficient of Thermal Expansion 16.6 10 -6 /K

Mechanical Properties

State Tensile Strength Yield Strength Hardness Elongation
  MPa ksi MPa HV A 50%
060 195-255 28-37 ≥55 50-80 ≥25%
H02 260-345 37.5-50 -- 80-120 ≥10%

*For Reference Only

Bending Performance

State 90°R/T 180°R/T
  Good Way Bad Way Good Way Bad Way
R410(1/2H) Good Good Good Good

*Test sample width 10mm thickness ≤0.5mm

Tolerance Accuracy

Thickness Deviation (mm) Width Deviation (mm)
Thickness a b≤50 Width b
50
100 Width b Deviation
a≤2.80 ±0.03 -- -- b≤25.00 ±0.13
2.80 ±0.05 ±0.08 -- 25.00 ±0.15
4.75 ±0.07 ±0.09 ±0.12 35.00 ±0.30
12.75 ±0.10 ±0.11 ±0.13 100 ±0.3%b
25.00 ±0.15 ±0.15 ±0.15 --  

Corrosion Resistance

It exhibits good corrosion resistance in most non-oxidizing acids, alkalis, salt solutions, and various organic solvents, and can maintain structural integrity and functional stability under harsh conditions such as humidity and salt spray.

Electroplated Copper Busbar

Our company uses industry-leading high-end electroplating technology to precisely plate tin or silver on the surface of copper bars and rods, ensuring that the products have excellent conductivity, corrosion resistance, and solderability. Relying on ultra-precision plating control technology, the thickness of the electroplated tin layer can be precisely controlled to 5-12 microns, and the thickness of the electroplated silver layer ranges from 0.2-5 microns. The plating is uniform, dense, and has extremely strong adhesion.

We use a fully automated continuous electroplating production line, combined with an intelligent detection system and nanometer-level surface treatment technology, to ensure that the plating is smooth, uniform, durable, and stable, meeting the stringent requirements of the power, electronics, new energy, and high-end manufacturing industries, providing customers with globally leading high-quality electroplated copper bar solutions.

Tin-plated copper bars

The surface is plated with a tin layer to enhance oxidation resistance, corrosion resistance, and solderability, improving conductivity and service life. The thickness of the electroplated tin layer ranges from 2-12 microns and can be adjusted according to specific application needs. It is widely used in the power, electronics, rail transit, and new energy industries to ensure the long-term stability and reliability of products in complex environments.

Silver-plated copper bars

The surface is plated with a silver layer to improve conductivity, oxidation resistance, and corrosion resistance, and to enhance welding performance and wear resistance. The thickness of the electroplated silver layer ranges from 0.2-8 microns and can be customized according to needs. It is widely used in the power, electrical, electronics, high-end manufacturing, and new energy fields to ensure the excellent performance and long-term stability of products in demanding environments.

Packaging

Wooden box packaging, single piece weight 700-1000kg

Specifications

Material thickness: 2-80mm, length: 1-6.0m, width: 25-300mm; can be provided according to customer requirements; hot-dip tinned strip and electroplated strip are available.

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Kainan Group Product Brochure

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Oxygen-free copper T1 (OFC)

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