Grade
China GB | TU2 |
American ASTM | C10200 |
European EN | - |
Japanese JIS | C1020 |
Chemical Composition
(Weight%)
Copper Cu | ≥99.95 |
Iron Fe | ≤0.004 |
Lead Pb | ≤0.004 |
Tin Sn | - |
Oxygen O | ≤0.002 |
Phosphorus P | ≤0.002 |
Zinc Zn | - |
Product Characteristics
Pure copper series, with good electrical and thermal conductivity, excellent processing performance and corrosion resistance.
Application Fields
● Electrical industry ● Power industry ● Communication industry ● Building decoration
Physical Properties
Density | 8.9 | g/cm³ |
Conductivity @20℃ | ≥99 | %IACS |
Electrical Conductivity @20℃ | - | MS/m |
Thermal Conductivity @20℃ | - | W/(m·K) |
Specific Heat | - | J/(g.K) |
Elastic Modulus | - | GPa |
Poisson's Ratio | - | GPa |
Coefficient of Thermal Expansion | - | 10 -6 /K |
Mechanical Properties
State | Tensile Strength | Yield Strength | Hardness | Elongation | |
MPa | ksi | MPa | HV | A 50% | |
R300(O) | ≥195 | ≥28 | -- | ≤60 | ≥35 |
R350(1/4H) | 245-340 | 36-49 | -- | 60-90 | ≥25 |
R410(1/2H) | 280-390 | 41-57 | -- | 80-110 | ≥15 |
R480(H) | 350-420 | 51-61 | -- | 100-120 | ≥5 |
R550(EH) | ≥360 | ≥52 | -- | 110-135 | -- |
R630(SH) | -- | -- | -- | -- | -- |
*For reference only
Bending Performance
State | 90°R/T | 180°R/T | ||
Good Way | Bad Way | Good Way | Bad Way | |
R350(1/4H) | -- | -- | -- | -- |
R410(1/2H) | Good | Good | Good | Good |
R480 | -- | -- | -- | -- |
*Test sample width 10mm thickness ≤0.5mm
Corrosion Resistance
Pure copper is stable in dry air and forms a protective oxide layer in humid environments, making it suitable for corrosive environments.
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